Dual Diode Modules Infineon Replacement

Diode-Diode Modules are monolithic design with dual topology of semiconductor (diode-diode type). Used in DC and AC circuits with loads to 700A and reverse pulse voltages up to 3600V.

Diode-Diode Modules AMDD AS ENERGITM is a replacement, equivalent and alternative semiconductor device for Dual Diode Modules DD Series Infineon Technologies.

The diode-diode modules are housed in a standard industrial case making it easy to easy integrate of the device into existing equipment.

Modules has different internal constructions: soldered construction – the contact is established by solder layers; pressure contact construction – the contact is established by pressure, solder free assembly.

Circuit Diagram of Diode-Diode Modules

The main (power) terminals are on the top of the case and are marked as 123 (common anode-cathode, cathode, anode).

The modules are designed and assembled in high reliable pressure contact and in solder bond technology which addresses the specific requirements of cost and performance optimized applications.

Diode modules are used in various power equipment - power and control units, electrical drives, power regulators, AC regulators, converters, controllers of blast furnaces or chemical processes, welding equipment, and as rectifiers for AC converters.

Our power modules are offered in several dual and single device topologies for almost all phase control or rectifier applications.

Our company provides a quality guarantee for thyristor / diode modules of 2 years from the date of purchase. When supplying thyristor / diode modules, if necessary, we provide technical passport and certificate of conformity.

The final price of thyristor / diode modules depends on the class, quantity, delivery terms, manufacturer, country of origin and form of payment.

For questions regarding the acquisition of Power Modules, Thyristors, Diodes, send an email request to:

[email protected]

And we will provide you a commercial offer for delivery.
For a large number, we will provide an individual price!!!

We are open to manufacture products at our production facilities
according to your requests and technical task.

General specifications of Diode-Diode Modules Infineon and Replacements

Type IF(AV)M
(TC,°C)
VRRM
VDRM
IFSM I2t VT0 rT Tvj max Rth(j-c) W Package, Dimensions L×B×H Replacement
AS ENERGITM
Data sheet
A V A kA2·s V mΩ ºC K/W kg mm PDF
Diode modules - baseplate 20x58 mm - solder solder
DD100N16S 134 (100) 1600 2000 20.00 0.87 2.45 130 0.20 0.075 DS20
93x20x30
AMDD100N16S
Diode modules - baseplate 20x92 mm - pressure contact
DD89N12K 89 (100) 1200 2400 28.80 0.75 2.30 150 0.45 0.16 DP20
92x20x30
AMDD89N12K
DD89N14K 89 (100) 1400 2400 28.80 0.75 2.30 150 0.45 0.16 DP20
92x20x30
AMDD89N14K
DD89N16K 89 (100) 1600 2400 28.80 0.75 2.30 150 0.45 0.16 DP20
92x20x30
AMDD89N16K
DD89N18K 89 (100) 1800 2400 28.80 0.75 2.30 150 0.45 0.16 DP20
92x20x30
AMDD89N18K
DD98N22K 98 (100) 2200 2000 20.00 0.82 2.00 150 0.39 0.16 DP20
92x20x30
AMDD98N22K
DD98N25K 98 (100) 2500 2000 20.00 0.82 2.00 150 0.39 0.16 DP20
92x20x30
AMDD98N25K
DD104N12K 104 (100) 1200 2500 31.25 0.70 2.10 150 0.39 0.16 DP20
92x20x30
AMDD104N12K
DD104N16K 104 (100) 1600 2500 31.25 0.70 2.10 150 0.39 0.16 DP20
92x20x30
AMDD104N16K
DD104N18K 104 (100) 1800 2500 31.25 0.70 2.10 150 0.39 0.16 DP20
92x20x30
AMDD104N18K
Diode modules - baseplate 34x94 mm - solder bond
DD170N16S 165 (100) 1600 5500 151.25 0.75 1.05 135 0.18 0.165 DS34
94x34x30
AMDD170N16S
DD170N36K 170 (100) 3600 4300 92.50 0.90 1.35 150 0.20 0.165 DS34
94x34x30
AMDD170N36K
DD180N16S 174 (100) 1600 5000 125.00 0.85 0.95 135 0.16 0.165 DS34-2
94x34x30
AMDD180N16S
DD180N22S 174 (100) 2200 5000 125.00 0.85 0.95 135 0.16 0.165 DS34-2
94x34x30
AMDD180N22S
DD220N16S 226 (100) 1600 4800 115.20 0.85 0.95 150 0.16 0.165 DS34-2
94x34x30
AMDD220N16S
DD220N22S 226 (100) 2200 4800 115.20 0.85 0.95 150 0.16 0.165 DS34-2
94x34x30
AMDD220N22S
Diode modules - baseplate 34x94 mm - pressure contact
DD160N22K 160 (100) 2200 4600 105.80 0.80 1.00 150 0.26 0.31 DP34
94x34x30
AMDD160N22K
DD171N12K 170 (100) 1200 5600 157.00 0.75 0.80 150 0.26 0.31 DP34
94x34x30
AMDD171N12K
DD171N16K 170 (100) 1600 5600 157.00 0.75 0.80 150 0.26 0.31 DP34
94x34x30
AMDD171N16K
DD171N18K 170 (100) 1800 5600 157.00 0.75 0.80 150 0.26 0.31 DP34
94x34x30
AMDD171N18K
Diode modules - baseplate 50x92 mm - solder bond
DD340N16S 330 (100) 1600 8500 385 0.81 0.30 130 0.086 0.37 DS50
115x50x53
AMDD340N16S
DD340N22S 330 (100) 2200 8500 385 0.81 0.30 130 0.086 0.37 DS50
115x50x53
AMDD340N22S
DD340N22S TIM 330 (100) 2200 8500 385 0.81 0.30 130 0.086 0.37 DS50
115x50x53
AMDD340N22S TIM
DD390N16S 390 (113) 1600 8500 385 0.81 0.30 150 0.086 0.37 DS50
115x50x53
AMDD390N16S
DD390N22S 390 (113) 2200 8500 385 0.81 0.30 150 0.086 0.37 DS50
115x50x53
AMDD390N22S
DD390N22S TIM 390 (113) 2200 8400 353 0.81 0.30 150 0.086 0.37 DS50
115x50x53
AMDD390N22S TIM
Diode modules - baseplate 50x92 mm - pressure contact
DD175N30K 175 (100) 3000 4000 80 0.90 1.80 150 0.17 0.8 DP50
115x50x52
AMDD175N30K
DD175N32K 175 (100) 3200 4000 80 0.90 1.80 150 0.17 0.8 DP50
115x50x52
AMDD175N32K
DD175N34K 175 (100) 3400 4000 80 0.90 1.80 150 0.17 0.8 DP50
115x50x52
AMDD175N34K
DD260N12K 260 (100) 1200 8300 344 0.70 0.68 150 0.17 0.8 DP50A
115x50x52
AMDD260N12K
DD260N16K 260 (100) 1600 8300 344 0.70 0.68 150 0.17 0.8 DP50A
115x50x52
AMDD260N16K
DD260N18K 260 (100) 1800 8300 344 0.70 0.68 150 0.17 0.8 DP50A
115x50x52
AMDD260N18K
DD261N20K 260 (100) 2000 8300 344 0.70 0.68 150 0.17 0.8 DP50A
115x50x52
AMDD261N20K
DD261N22K 260 (100) 2200 8300 344 0.70 0.68 150 0.17 0.8 DP50A
115x50x52
AMDD261N22K
DD285N02K 285 (100) 200 8300 344 0.75 0.40 150 0.17 0.8 DP50
115x50x52
AMDD285N02K
DD350N12K 350 (100) 1200 11000 605 0.75 0.40 150 0.13 0.8 DP50A
115x50x52
AMDD350N12K
DD350N14K 350 (100) 1400 11000 605 0.75 0.40 150 0.13 0.8 DP50A
115x50x52
AMDD350N14K
DD350N16K 350 (100) 1600 11000 605 0.75 0.40 150 0.13 0.8 DP50A
115x50x52
AMDD350N16K
DD350N18K 350 (100) 1800 11000 605 0.75 0.40 150 0.13 0.8 DP50A
115x50x52
AMDD350N18K
DD360N22K 360 (100) 2200 13000 550 0.75 0.40 150 0.125 0.8 DP50A
115x50x52
AMDD360N22K
DD380N16K 380 (100) 1600 11500 660 0.75 0.32 150 0.125 0.8 DP50A
115x50x52
AMDD380N16K
Diode modules - baseplate 60x124 mm - pressure contact
DD435N34K 435 (100) 3400 12000 720 0.84 0.60 150 0.078 1.5 DP60
150x60x52
AMDD435N34K
DD435N36K 435 (100) 3600 12000 720 0.84 0.60 150 0.078 1.5 DP60
150x60x52
AMDD435N36K
DD435N40K 435 (100) 4000 12000 720 0.84 0.60 150 0.078 1.5 DP60
150x60x52
AMDD435N40K
DD540N22K 540 (100) 2200 14000 980 0.78 0.31 150 0.078 1.5 DP60A
150x60x52
AMDD540N22K
DD540N26K 540 (100) 2600 14000 980 0.78 0.31 150 0.078 1.5 DP60
150x60x52
AMDD540N26K
DD600N12K 600 (100) 1200 19000 1800 0.75 0.215 150 0.078 1.5 DP60A
150x60x52
AMDD600N12K
DD600N14K 600 (100) 1400 19000 1800 0.75 0.215 150 0.078 1.5 DP60A
150x60x52
AMDD600N14K
DD600N16K 600 (100) 1600 19000 1800 0.75 0.215 150 0.078 1.5 DP60A
150x60x52
AMDD600N16K
DD600N18K 600 (100) 1800 19000 1800 0.75 0.215 150 0.078 1.5 DP60A
150x60x52
AMDD600N18K
DD700N22K 700 (100) 2200 21000 1805 0.78 0.19 150 0.065 1.5 DP60A
150x60x52
AMDD700N22K
DD710N16K 710 (100) 1600 26000 2420 0.75 0.15 150 0.065 1.5 DP60A
150x60x52
AMDD710N16K

Drawings and housings dimensions for Modules:


Part Numbering Guide for Diode-Diode Modules:

A M DD 700 N 22 K
A brand AS ENERGITM
M Product group: Module.
DD Circuit topology: Diode-Diode.
700 Average on-state current IT(AV), Amp.
N Rectifier device.
22 Voltage class VRRM / 100.
K Mechanical construction:
K – pressure contact technology
S – solder technology

Circuit diagram of Diode-Diode Modules:

circuit

AK, K, A (1, 2, 3) – main (power) terminals.


Recommendations for mounting power modules

Heatsink and Surface Specifications, Preparation

In order to ensure good thermal contact and to obtain the thermal contact resistance values specified in the datasheets, the contact surface of the heat sink must be clean and free from dust particles. It is useful to clean the mounting surface of the heat sink with wipes and an alcohol cleaner, e.g. isopropanol, right before the mounting process. The following mechanical specifications have to be met:
– Unevenness of heat sink mounting area must be ≤ 50μm per 100 mm
– Roughness Rz: < 10 μm
– No steps > 10 μm


Heat sink surface specification

Applying Thermal Paste

Recommended to use stencil printing in order to apply thermal interface material. Recommended to use thermal paste thickness in the range from 50 μm to 100 μm. Applying thermal paste by means of roller is not recommended for mass production as reproducible of an optimized thermal paste thickness cannot be guaranteed.

Mounting torque on heat sink MS

To secure power modules, the use of steel screws in combination with suitable washers and spring lock washers or combination screws is strongly recommended. The specified in datasheet torque value must be observed.

A pre-tightening torque and retightening to the given torque value is recommended. For the screwing process the speed has to be limited and soft torque limitation is recommended to avoid torque peaks, which may occur with pneumatic screwdrivers.


Example of mounting order

The screws must be tightened in diagonal order with equal torque in several steps until the specified torque value MS has been reached.


icon Why choose AS ENERGITM

  • Own production facilities, including semiconductor silicon chips production
  • European brand - 100% quality, favorable price, short production terms
  • Over 20 years of experience in the semiconductor industry
  • Clients from more than 50 countries trust us
  • 10000 items in the product line for currents from 10A to 15000A, voltages from 100V to 9000V
  • We produce analogues of other manufacturers' products
  • Guaranteed certified quality, warranty period of operation - 2 years

 

Quality Warranty

Our products are certified and correspond to international standards.
Our company provides a quality guarantee for products of 2 years.
We provide certificates of conformity, reliability reports, data sheets and technical passports at the request of the customer.

Certificates

Each product is tested for the main parameters, and Test reports of the parameters for each product are provided.

Test Report

Geography of partnership

AS ENERGITM company supplies power semiconductors and other equipment to more than 50 countries around the world.

Geography

Logistics and Delivery

We deliver our products all over the world with the services of logistics companies: DHL, TNT, UPS, EMS, Fedex, Aramex.
Products can be delivered by any means of transport: air, sea, rail and road.

Logistics

AS ENERGITM Semiconductors Manufacturing

Our products range includes rectifier diodes, phase control thyristors in disc and stud design, avalanche diodes and thyristors, fast switching, high frequency thyristors, fast recovery, welding and rotor diodes, triacs, bridge rectifiers, power modules (thyristor, diode, thyristor-diode, IGBT), and air and water heatsinks to them.

Power diodes and thyristors are produced for currents from 10A to 15000A, voltage range from 100V to 9000V.
Power diode and thyristor modules are produced from 25A and up to 1250A, voltage range 400V - 4400V.
The range of power semiconductors also includes equivalent, replacement, analogue and alternative semiconductor devices of global manufacturers.

GİZEM GÖZÜN 26.01.2021 at 13:04
8
I'm Gizem, I'm a chemical engineer. I'm interested in making ceramic stuffs as a hobby. Would you please give some explanation about my questions below;
1) If I only mix SiO2 and Fe2O3 (3:1), can i get a suitable product without using other components?
2) Can i use water as fastener? or would you suggest me another fastener?
3) At which temperature should i mix them?
Thank you for your interest, Kind Regards
26.01.2021 at 14:43
5
Hello, Gizem. The mass of ceramic is produced by grinding and mixing with water of different components: clay, feldspar, sand, kaolin. The proportions of these materials are different percentages, depending on what and with what characteristics you need to get a ceramic mass.
Each manufacturer of ceramic mass has its own recipes and its own raw materials, which are available in its region.
There are also books on ceramics that specify the chemical composition and approximate recipes for ceramic masses.
Roman 27.06.2022 at 00:03
3
Is It need to apply vaselin or thermal past at Thyristor surfaces then attach to radiator/current leading parts?
Maksim 27.06.2022 at 10:39
3
When assembling thyristors, diodes with heat sinks, it is recommended to lubricate the contact surfaces with a thin layer of heat conducting paste to improve the heat transfer parameters. But this is not a prerequisite for assembly.

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