Dual Diode Modules Infineon Replacement

Diode-Diode Modules are monolithic design with dual topology of semiconductor (diode-diode type). Used in DC and AC circuits with loads to 700A and reverse pulse voltages up to 3600V.

Diode-Diode Modules AMDD AS ENERGI^TM is a replacement, equivalent and alternative semiconductor device for Dual Diode Modules DD Series Infineon Technologies.

The diode-diode modules are housed in a standard industrial case making it easy to easy integrate of the device into existing equipment.

Modules has different internal constructions: soldered construction – the contact is established by solder layers; pressure contact construction – the contact is established by pressure, solder free assembly.

The main (power) terminals are on the top of the case and are marked as 1, 2, 3 (common anode-cathode, cathode, anode).

The modules are designed and assembled in high reliable pressure contact and in solder bond technology which addresses the specific requirements of cost and performance optimized applications.

Diode modules are used in various power equipment - power and control units, electrical drives, power regulators, AC regulators, converters, controllers of blast furnaces or chemical processes, welding equipment, and as rectifiers for AC converters.

Our power modules are offered in several dual and single device topologies for almost all phase control or rectifier applications.

Our company provides a quality guarantee for thyristor / diode modules of 2 years from the date of purchase. When supplying thyristor / diode modules, if necessary, we provide technical passport and certificate of conformity.

The final price of thyristor / diode modules depends on the class, quantity, delivery terms, manufacturer, country of origin and form of payment.

For questions regarding the acquisition of Power Modules, Thyristors, Diodes, send an email request to:

[email protected]

And we will provide you a commercial offer for delivery.
For a large number, we will provide an individual price!!!

We are open to manufacture products at our production facilities
according to your requests and technical task.

Photo Gallery

The photo gallery shows many different semiconductor devices, semiconductor chips and SCRs produced by AS ENERGI^TM, examples of test reports.

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General specifications of Diode-Diode Modules Infineon and Replacements

Type	I_F(AV)M (T_C,°C)	V_RRM V_DRM	I_FSM	I²t	V_T0	r_T	T_{vj max}	R_th(j-c)	W	Package, Dimensions L×B×H	Data sheet	Replacement and Datasheet AS ENERGI^TM
Type	A	V	A	kA²·s	V	mΩ	ºC	K/W	kg	mm	PDF	Replacement and Datasheet AS ENERGI^TM
Diode modules - baseplate 20x58 mm - solder solder
DD100N16S	134 (100)	1600	2000	20.00	0.87	2.45	130	0.20	0.075	DS20 93x20x30		AMDD100N16S
Diode modules - baseplate 20x92 mm - pressure contact
DD89N12K	89 (100)	1200	2400	28.80	0.75	2.30	150	0.45	0.16	DP20 92x20x30		AMDD89N12K
DD89N14K	89 (100)	1400	2400	28.80	0.75	2.30	150	0.45	0.16	DP20 92x20x30		AMDD89N14K
DD89N16K	89 (100)	1600	2400	28.80	0.75	2.30	150	0.45	0.16	DP20 92x20x30		AMDD89N16K
DD89N18K	89 (100)	1800	2400	28.80	0.75	2.30	150	0.45	0.16	DP20 92x20x30		AMDD89N18K
DD98N22K	98 (100)	2200	2000	20.00	0.82	2.00	150	0.39	0.16	DP20 92x20x30		AMDD98N22K
DD98N25K	98 (100)	2500	2000	20.00	0.82	2.00	150	0.39	0.16	DP20 92x20x30		AMDD98N25K
DD104N12K	104 (100)	1200	2500	31.25	0.70	2.10	150	0.39	0.16	DP20 92x20x30		AMDD104N12K
DD104N16K	104 (100)	1600	2500	31.25	0.70	2.10	150	0.39	0.16	DP20 92x20x30		AMDD104N16K
DD104N18K	104 (100)	1800	2500	31.25	0.70	2.10	150	0.39	0.16	DP20 92x20x30		AMDD104N18K
Diode modules - baseplate 34x94 mm - solder bond
DD170N16S	165 (100)	1600	5500	151.25	0.75	1.05	135	0.18	0.165	DS34 94x34x30		AMDD170N16S
DD170N36K	170 (100)	3600	4300	92.50	0.90	1.35	150	0.20	0.165	DP34 94x34x30		AMDD170N36K
DD180N16S	174 (100)	1600	5000	125.00	0.85	0.95	135	0.16	0.165	DS34-2 94x34x30		AMDD180N16S
DD180N22S	174 (100)	2200	5000	125.00	0.85	0.95	135	0.16	0.165	DS34-2 94x34x30		AMDD180N22S
DD220N16S	226 (100)	1600	4800	115.20	0.85	0.95	150	0.16	0.165	DS34-2 94x34x30		AMDD220N16S
DD220N22S	226 (100)	2200	4800	115.20	0.85	0.95	150	0.16	0.165	DS34-2 94x34x30		AMDD220N22S
Diode modules - baseplate 34x94 mm - pressure contact
DD160N22K	160 (100)	2200	4600	105.80	0.80	1.00	150	0.26	0.31	DP34 94x34x30		AMDD160N22K
DD171N12K	170 (100)	1200	5600	157.00	0.75	0.80	150	0.26	0.31	DP34 94x34x30		AMDD171N12K
DD171N16K	170 (100)	1600	5600	157.00	0.75	0.80	150	0.26	0.31	DP34 94x34x30		AMDD171N16K
DD171N18K	170 (100)	1800	5600	157.00	0.75	0.80	150	0.26	0.31	DP34 94x34x30		AMDD171N18K
Diode modules - baseplate 50x92 mm - solder bond
DD340N16S	330 (100)	1600	8500	385	0.81	0.30	130	0.086	0.37	DS50 115x50x53		AMDD340N16S
DD340N22S	330 (100)	2200	8500	385	0.81	0.30	130	0.086	0.37	DS50 115x50x53		AMDD340N22S
DD340N22S TIM	330 (100)	2200	8500	385	0.81	0.30	130	0.086	0.37	DS50 115x50x53		AMDD340N22S TIM
DD390N16S	390 (113)	1600	8500	385	0.81	0.30	150	0.086	0.37	DS50 115x50x53		AMDD390N16S
DD390N22S	390 (113)	2200	8500	385	0.81	0.30	150	0.086	0.37	DS50 115x50x53		AMDD390N22S
DD390N22S TIM	390 (113)	2200	8400	353	0.81	0.30	150	0.086	0.37	DS50 115x50x53		AMDD390N22S TIM
Diode modules - baseplate 50x92 mm - pressure contact
DD175N30K	175 (100)	3000	4000	80	0.90	1.80	150	0.17	0.8	DP50 115x50x52		AMDD175N30K
DD175N32K	175 (100)	3200	4000	80	0.90	1.80	150	0.17	0.8	DP50 115x50x52		AMDD175N32K
DD175N34K	175 (100)	3400	4000	80	0.90	1.80	150	0.17	0.8	DP50 115x50x52		AMDD175N34K
DD260N12K	260 (100)	1200	8300	344	0.70	0.68	150	0.17	0.8	DP50A 115x50x52		AMDD260N12K
DD260N16K	260 (100)	1600	8300	344	0.70	0.68	150	0.17	0.8	DP50A 115x50x52		AMDD260N16K
DD260N18K	260 (100)	1800	8300	344	0.70	0.68	150	0.17	0.8	DP50A 115x50x52		AMDD260N18K
DD261N20K	260 (100)	2000	8300	344	0.70	0.68	150	0.17	0.8	DP50A 115x50x52		AMDD261N20K
DD261N22K	260 (100)	2200	8300	344	0.70	0.68	150	0.17	0.8	DP50A 115x50x52		AMDD261N22K
DD285N04K	285 (100)	400	8300	344	0.75	0.40	150	0.17	0.8	DP50 115x50x52		AMDD285N04K
DD350N12K	350 (100)	1200	11000	605	0.75	0.40	150	0.13	0.8	DP50A 115x50x52		AMDD350N12K
DD350N14K	350 (100)	1400	11000	605	0.75	0.40	150	0.13	0.8	DP50A 115x50x52		AMDD350N14K
DD350N16K	350 (100)	1600	11000	605	0.75	0.40	150	0.13	0.8	DP50A 115x50x52		AMDD350N16K
DD350N18K	350 (100)	1800	11000	605	0.75	0.40	150	0.13	0.8	DP50A 115x50x52		AMDD350N18K
DD360N22K	360 (100)	2200	13000	550	0.75	0.40	150	0.125	0.8	DP50A 115x50x52		AMDD360N22K
DD380N16K	380 (100)	1600	11500	660	0.75	0.32	150	0.125	0.8	DP50A 115x50x52		AMDD380N16K
Diode modules - baseplate 60x124 mm - pressure contact
DD435N34K	435 (100)	3400	12000	720	0.84	0.60	150	0.078	1.5	DP60 150x60x52		AMDD435N34K
DD435N36K	435 (100)	3600	12000	720	0.84	0.60	150	0.078	1.5	DP60 150x60x52		AMDD435N36K
DD435N40K	435 (100)	4000	12000	720	0.84	0.60	150	0.078	1.5	DP60 150x60x52		AMDD435N40K
DD540N22K	540 (100)	2200	14000	980	0.78	0.31	150	0.078	1.5	DP60A 150x60x52		AMDD540N22K
DD540N26K	540 (100)	2600	14000	980	0.78	0.31	150	0.078	1.5	DP60 150x60x52		AMDD540N26K
DD600N12K	600 (100)	1200	19000	1800	0.75	0.215	150	0.078	1.5	DP60A 150x60x52		AMDD600N12K
DD600N14K	600 (100)	1400	19000	1800	0.75	0.215	150	0.078	1.5	DP60A 150x60x52		AMDD600N14K
DD600N16K	600 (100)	1600	19000	1800	0.75	0.215	150	0.078	1.5	DP60A 150x60x52		AMDD600N16K
DD600N18K	600 (100)	1800	19000	1800	0.75	0.215	150	0.078	1.5	DP60A 150x60x52		AMDD600N18K
DD700N22K	700 (100)	2200	21000	1805	0.78	0.19	150	0.065	1.5	DP60A 150x60x52		AMDD700N22K
DD710N16K	710 (100)	1600	26000	2420	0.75	0.15	150	0.065	1.5	DP60A 150x60x52		AMDD710N16K

Drawings and housings dimensions for Modules:

Part Numbering Guide for Diode-Diode Modules:

700

A	–	AS ENERGI^TM
M	–	Product group: Module.
DD	–	Circuit topology: Diode-Diode.
700	–	Average on-state current I_T(AV), Amp.
N	–	Rectifier device.
22	–	Voltage class V_RRM / 100.
K	–	Mechanical construction: K – pressure contact technology S – solder technology

Circuit diagram of Diode-Diode Modules:

AK, K, A (1, 2, 3) – main (power) terminals.

Recommendations for mounting power modules

Heatsink and Surface Specifications, Preparation

In order to ensure good thermal contact and to obtain the thermal contact resistance values specified in the datasheets, the contact surface of the heat sink must be clean and free from dust particles. It is useful to clean the mounting surface of the heat sink with wipes and an alcohol cleaner, e.g. isopropanol, right before the mounting process. The following mechanical specifications have to be met:
– Unevenness of heat sink mounting area must be ≤ 50μm per 100 mm
– Roughness Rz: < 10 μm
– No steps > 10 μm

Heat sink surface specification

Applying Thermal Paste

Recommended to use stencil printing in order to apply thermal interface material. Recommended to use thermal paste thickness in the range from 50 μm to 100 μm. Applying thermal paste by means of roller is not recommended for mass production as reproducible of an optimized thermal paste thickness cannot be guaranteed.

Mounting torque on heat sink M_S

To secure power modules, the use of steel screws in combination with suitable washers and spring lock washers or combination screws is strongly recommended. The specified in datasheet torque value must be observed.

A pre-tightening torque and retightening to the given torque value is recommended. For the screwing process the speed has to be limited and soft torque limitation is recommended to avoid torque peaks, which may occur with pneumatic screwdrivers.

Example of mounting order

The screws must be tightened in diagonal order with equal torque in several steps until the specified torque value M_S has been reached.

Why choose AS ENERGI^TM

Own production facilities, including semiconductor silicon chips production
European brand - 100% quality, favorable price, short production terms
Over 20 years of experience in the semiconductor industry
Clients from more than 50 countries trust us
20000 items in the product line for currents from 10A to 15000A, voltages from 100V to 9000V
We produce analogues of other manufacturers' products
Guaranteed certified quality, warranty period of operation - 2 years

Quality Warranty

Our products are certified and correspond to international standards.
Our company provides a quality guarantee for products of 2 years.
We provide certificates of conformity, reliability reports, data sheets and technical passports at the request of the customer.

Each product is tested for the main parameters, and Test reports of the parameters for each product are provided.

Geography of partnership

AS ENERGI^TM company manufactures and supplies power semiconductors to more than 50 countries around the world.

Logistics and Delivery

We deliver our products all over the world with the services of logistics companies: DHL, TNT, UPS, EMS, Fedex, Aramex.
Products can be delivered by any means of transport: air, sea, rail and road.

AS ENERGI^TM Semiconductors Manufacturing

Our products range includes rectifier diodes, phase control thyristors in disc and stud design, avalanche diodes and thyristors, fast switching, high frequency thyristors, fast recovery, welding and rotor diodes, triacs, bridge rectifiers, power modules (thyristor, diode, thyristor-diode, IGBT), and air and water heatsinks to them.

Power diodes and thyristors are produced for currents from 10A to 15000A, voltage range from 100V to 9000V.
Power diode and thyristor modules are produced from 25A and up to 1250A, voltage range 400V - 4400V.
The range of power semiconductors also includes equivalent, replacement, analogue and alternative semiconductor devices of global manufacturers.

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