Air Cooling Heatsink SF series for thyristor & rectifier diode

Air Cooling Heatsink SF series for cooling power SCR thyristors and diodes in disc design during their operation.

Features: natural air cooling and forced air cooling; disc package is apply to many kinds of mounting clamp (max diameter is 96 mm); low thermal resistance; can be either standard models can also be customizing.

Technical passport for air cooling heatsinks

Installation recommendations.
Check the cooling body mesa parallelism and flatness. Heat sink must be compatible with device mesa, prevent flattening pressure slanting, damage to the device. Mesa should maintain clean without oil stolen goods, etc. Ensure the device parallel to the mesa heat sink fully and concentric. When assembling, the necessary clamping force specific for each type of thyristor, diode package must be provided.

Types of Air Cooling Heatsinks: SF12, SF13, SF14, SF15, SF16, SF17 – air cooling heat sink for single device; SF12BL, SF13BL, SF15BL, SF15CL – air cooling heat sink for double devices and inverse parallel connection power sets.

Specifications and parameters, dimensions, drawings of air-cooled heat sink (radiator) are listed below.

Our company provides a quality guarantee for air cooling heatsink SF series of 2 years from the date of purchase. When supplying heatsinks, if necessary, we provide technical passport.

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The final price of air cooling heatsink SF series depends on the quantity, delivery terms, manufacturer, country of origin and form of payment.

SF12, SF13 Air Cooling Heatsink for single device specifications

Type Surface diameter Applicable case surface Mounting force P Thermal resistance Flow resistance Weight Application
Plate surface Raised surface Raised surface Plate surface kN °C/W Pa kg
SF12 Ø65 Ø23, Ø27 Ø19-Ø40 Ø24-Ø27 3.3-20 0.090 45 ≥ 3.0 200-800A devices, wind speed ≥ 4 m/sec
SF13 Ø65 Ø27, Ø31 Ø34-Ø40 Ø28-Ø32 5.5-25 0.071 55 ≥ 4.1
Type Outline size Arcpower lead size Mounting size
L D H L1 D1 H1 D2 H2 H3 d d1 a c e g i k
SF12 200 110 125 60 40 8 80 15 22 Ø13 M3 20 20 55 30 6 20
SF13 220 120 130 60 40 8 90 15 45 Ø13 M3 20 20 64 53 6 20
SF12, SF13 Heatsink Drawing

SF14, SF15, SF16, SF17 Air Cooling Heatsink for single device specifications

Type Surface diameter Applicable case surface Mounting force P Thermal resistance Flow resistance Weight Application
Plate surface Raised surface Raised surface Plate surface kN °C/W Pa kg
SF14 Ø82 Ø32, Ø37 Ø34-Ø45 Ø32-Ø37 5.5-30 0.056 60 ≥ 5.7 600-2000A devices, wind speed ≥ 4 m/sec.
≥ 1500A devices, wind speed ≥ 6 m/sec.
SF15 Ø82 Ø32, Ø37, Ø42 Ø40-Ø47 Ø32-Ø42 10-34 0.048 65 ≥ 8.0
SF16 Ø82 - Ø45-Ø65 - 15-40 0.037 70 ≥ 11.0
SF17 Ø120 - Ø40-Ø73 - 15-47 0.030 75 ≥ 14.0
Type Outline size Arcpower lead size Mounting size
L D H L1 D1 H1 D2 H2 H3 d d1 a b c e f g i j k
SF14 250 140 145 80 50 10 105 15 45 Ø11 M6 12.5 25 12.5 40 35 55 8 20 25
SF15 280 140 165 80 60 12 105 15 50 Ø13 M8 17.5 25 15 40 35 62 8 20 25
SF16 280 180 200 80 60 12 130 15 66 Ø13 M8 17.5 25 15 40 40 78 8 20 25
SF17 300 200 215 80 60 12 130 15 73 Ø13 M8 17.5 25 15 40 40 85 8 24 25
SF14, SF15, SF16, SF17 Heatsink Drawing

SF12BL Air Cooling Heatsink for double devices specifications

Type Surface diameter Applicable case surface Mounting force P Thermal resistance Flow resistance Weight Application
mm mm kN °C/W Pa kg
SF12BL Ø27 Ø19-Ø25 3.3-20 0.150 45 ≥ 3.0 200A element assemblings, and inverse parallel connection power sets, wind speed ≥ 4m/sec
SF12BL Heatsink Outline

SF13BL Air Cooling Heatsink for double devices specifications

Type Surface diameter Applicable case surface Mounting force P Thermal resistance Flow resistance Weight Application
mm mm kN °C/W Pa kg
SF13BL Ø66 Ø34 5.5-25 0.130 45 ≥ 4.1 200A-300A element assemblings, and inverse parallel connection power sets, wind speed ≥ 4m/sec
SF13BL Heatsink Outline

SF15BL Air Cooling Heatsink for double devices specifications

Type Surface diameter Applicable case surface Mounting force P Thermal resistance Flow resistance Weight Application
mm mm kN °C/W Pa kg
SF15BL Ø82 Ø34-Ø45 10-34 0.090 45 ≥ 8.0 300A-500A element assemblings, and inverse parallel connection power sets, wind speed ≥ 4m/sec
SF15BL Heatsink Outline

SF15CL Air Cooling Heatsink for double devices specifications

Type Surface diameter Applicable case surface Mounting force P Thermal resistance Flow resistance Weight Application
mm mm kN °C/W Pa kg
SF15CL Ø82 Ø34-Ø45 10-34 0.090 45 ≥ 8.0 300A-500A element assemblings, and inverse parallel connection power sets, wind speed ≥ 6m/sec
SF15CL Heatsink Outline

Technical Passport for Air Cooling Heatsink SF series (sample):

When supplying thyristors, diodes, heatsinks if necessary, we provide technical passport and certificate of conformity.

  • Technical Passport
  • Technical Passport

High Power Semiconductors AS ENERGITM

Our company is engaged in the manufacturer and sale of wide range of power semiconductors (power thyristors, modules, rectifier diodes, avalanche, rotor and welding diodes, triacs etc.) currents up to 15000A and voltages to 9000V, and air and water heatsinks to them.
You can buy semiconductor devices in any volumes, and when ordering large lots, the price will be lower. We have earned the trust of customers and supply products all over the world.

For questions regarding the acquisition of Power Thyristors, Diodes, Modules send an email request to:

[email protected]

And we will provide you a commercial offer for delivery.
For a large number, we will provide an individual price!!!

We are open to manufacture products at our production facilities
according to your requests and technical task.


Photo of Air Cooling Heatsinks:

GİZEM GÖZÜN 26.01.2021 at 13:04
4
I'm Gizem, I'm a chemical engineer. I'm interested in making ceramic stuffs as a hobby. Would you please give some explanation about my questions below;
1) If I only mix SiO2 and Fe2O3 (3:1), can i get a suitable product without using other components?
2) Can i use water as fastener? or would you suggest me another fastener?
3) At which temperature should i mix them?
Thank you for your interest, Kind Regards
26.01.2021 at 14:43
2
Hello, Gizem. The mass of ceramic is produced by grinding and mixing with water of different components: clay, feldspar, sand, kaolin. The proportions of these materials are different percentages, depending on what and with what characteristics you need to get a ceramic mass.
Each manufacturer of ceramic mass has its own recipes and its own raw materials, which are available in its region.
There are also books on ceramics that specify the chemical composition and approximate recipes for ceramic masses.
Roman 27.06.2022 at 00:03
0
Is It need to apply vaselin or thermal past at Thyristor surfaces then attach to radiator/current leading parts?
Maksim 27.06.2022 at 10:39
0
When assembling thyristors, diodes with heat sinks, it is recommended to lubricate the contact surfaces with a thin layer of heat conducting paste to improve the heat transfer parameters. But this is not a prerequisite for assembly.

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