Air Cooling Heatsink SF series for thyristor & rectifier diode

Air Cooling Heatsink SF series for cooling power SCR thyristors and rectifier diodes in disc design during their operation.

Features: natural air cooling and forced air cooling; disc package is apply to many kinds of mounting clamp (max diameter is 96 mm); low thermal resistance; can be either standard models can also be customizing.

Technical passport for air cooling heatsinks

Installation recommendations.
Check the cooling body mesa parallelism and flatness. Heat sink must be compatible with device mesa, prevent flattening pressure slanting, damage to the device. Mesa should maintain clean without oil stolen goods, etc. Ensure the device parallel to the mesa heat sink fully and concentric. When assembling, the necessary clamping force specific for each type of thyristor, diode package must be provided.

Types of Air Cooling Heatsinks: SF11, SF12, SF13, SF14, SF15, SF16, SF17, SF18 – air cooling heat sink for single device; SF12BL, SF13BL, SF15BL, SF15CL – air cooling heat sink for double devices and inverse parallel connection power sets.

Specifications and parameters, dimensions, drawings of air-cooled heat sink (radiator) are listed below.

Our company provides a quality guarantee for air cooling heatsink SF series of 2 years from the date of purchase. When supplying heatsinks, if necessary, we provide technical passport.

The final price of air cooling heatsink SF series depends on the quantity, delivery terms, manufacturer, country of origin and form of payment.

SF11, SF12, SF13 Air Cooling Heatsink for single device specifications

Type	Surface diameter		Applicable case surface		Mounting force P	Thermal resistance	Flow resistance	Weight	Application	Data sheet
Type	Plate surface	Raised surface	Raised surface	Plate surface	kN	°C/W	Pa	kg	Application	PDF
SF11	Ø65	Ø23, Ø27	Ø19-Ø40	Ø24-Ø27	3.3-20	0.090	45	≥ 2.5	200-800A devices, wind speed ≥ 4 m/sec
SF12	Ø65	Ø23, Ø27	Ø19-Ø40	Ø24-Ø27	3.3-20	0.090	45	≥ 3.0
SF13	Ø65	Ø27, Ø31	Ø34-Ø40	Ø28-Ø32	5.5-25	0.071	55	≥ 4.1

Type	Outline size			Arcpower lead size			Mounting size											Data sheet
Type	L	D	H	L1	D1	H1	D2	H2	H3	d	d1	a	c	e	g	i	k	PDF
SF11	170	110	125	60	40	8	80	15	22	Ø13	M3	20	20	55	30	6	20
SF12	200	110	125	60	40	8	80	15	22	Ø13	M3	20	20	55	30	6	20
SF13	220	120	130	60	40	8	90	15	45	Ø13	M3	20	20	64	53	6	20

SF14, SF15, SF16, SF17, SF17A, SF18, SF18A Air Cooling Heatsink for single device specifications

Type	Surface diameter		Applicable case surface		Mounting force P	Thermal resistance	Flow resistance	Weight	Application	Data sheet
Type	Plate surface	Raised surface	Raised surface	Plate surface	kN	°C/W	Pa	kg	Application	PDF
SF14	Ø82	Ø32, Ø37	Ø34-Ø45	Ø32-Ø37	5.5-30	0.056	60	≥ 5.7	600-2000A devices, wind speed ≥ 4 m/sec. ≥ 1500A devices, wind speed ≥ 6 m/sec.
SF15	Ø82	Ø32, Ø37, Ø42	Ø40-Ø47	Ø32-Ø42	10-34	0.048	65	≥ 8.0
SF16	Ø82	-	Ø45-Ø65	-	15-40	0.037	70	≥ 11.0
SF17	Ø120	-	Ø40-Ø73	-	15-47	0.030	75	≥ 14.0
SF18	Ø120	-	Ø40-Ø73	-	15-47	0.030	75	≥ 14.0

Type	Outline size			Arcpower lead size			Mounting size														Data sheet
Type	L	D	H	L1	D1	H1	D2	H2	H3	d	d1	a	b	c	e	f	g	i	j	k	PDF
SF14	250	140	145	80	50	10	105	15	45	Ø11	M6	12.5	25	12.5	40	35	55	8	20	25
SF15	280	140	165	80	60	12	105	15	50	Ø13	M8	17.5	25	15	40	35	62	8	20	25
SF16	280	180	200	80	60	12	130	15	66	Ø13	M8	17.5	25	15	40	40	78	8	20	25
SF17	300	200	215	80	60	12	140	15	73	Ø13	M8	17.5	25	15	40	40	85	8	20	25
SF17A	300	200	225	80	60	12	140	15	73	Ø13	M8	17.5	25	15	40	40	94	8	20	25
SF18	390	240	225	90	70	13	150	15	72	Ø13	M8	22.5	25	20	80	50	85	8	20	25
SF18A	390	240	225	90	70	13	185	15	72	Ø13	M8	22.5	25	20	80	50	85	8	20	25

SF12BL Air Cooling Heatsink for double devices specifications

Type	Surface diameter	Applicable case surface	Mounting force P	Thermal resistance	Flow resistance	Weight	Application	Data sheet
Type	mm	mm	kN	°C/W	Pa	kg	Application	PDF
SF12BL	Ø27	Ø19-Ø25	3.3-20	0.150	45	≥ 3.0	200A element assemblings, and inverse parallel connection power sets, wind speed ≥ 4m/sec

SF13BL Air Cooling Heatsink for double devices specifications

Type	Surface diameter	Applicable case surface	Mounting force P	Thermal resistance	Flow resistance	Weight	Application	Data sheet
Type	mm	mm	kN	°C/W	Pa	kg	Application	PDF
SF13BL	Ø66	Ø34	5.5-25	0.130	45	≥ 4.1	200A-300A element assemblings, and inverse parallel connection power sets, wind speed ≥ 4m/sec

SF15BL Air Cooling Heatsink for double devices specifications

Type	Surface diameter	Applicable case surface	Mounting force P	Thermal resistance	Flow resistance	Weight	Application	Data sheet
Type	mm	mm	kN	°C/W	Pa	kg	Application	PDF
SF15BL	Ø82	Ø34-Ø45	10-34	0.090	45	≥ 8.0	300A-500A element assemblings, and inverse parallel connection power sets, wind speed ≥ 4m/sec

SF15CL Air Cooling Heatsink for double devices specifications

Type	Surface diameter	Applicable case surface	Mounting force P	Thermal resistance	Flow resistance	Weight	Application	Data sheet
Type	mm	mm	kN	°C/W	Pa	kg	Application	PDF
SF15CL	Ø82	Ø34-Ø45	10-34	0.090	45	≥ 8.0	300A-500A element assemblings, and inverse parallel connection power sets, wind speed ≥ 6m/sec

Technical Passport for Air Cooling Heatsink SF series (sample):

When supplying thyristors, diodes, heatsinks if necessary, we provide technical passport and certificate of conformity.

High Power Semiconductors AS ENERGI^TM

Our company is engaged in the manufacturer and sale of wide range of power semiconductors (power thyristors, modules, rectifier diodes, avalanche, rotor and welding diodes, triacs etc.) currents up to 15000A and voltages to 9000V, and air and water heatsinks to them.
You can buy semiconductor devices in any volumes, and when ordering large lots, the price will be lower. We have earned the trust of customers and supply products all over the world.

For questions regarding the acquisition of Power Thyristors, Diodes, Modules send an email request to:

[email protected]

And we will provide you a commercial offer for delivery.
For a large number, we will provide an individual price!!!

We are open to manufacture products at our production facilities
according to your requests and technical task.

Photo Gallery

The photo gallery shows many different semiconductor devices, semiconductor chips and SCRs produced by AS ENERGI^TM, examples of test reports.

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Photo of Air Cooling Heatsinks:

Recommendations for assembling a disc thyristor with an air heatsink:

Assembling disc thyristor with a heatsink

The reliability of heat transfer and electrical contact between the mating surfaces of the thyristor and the cooler over the entire temperature range is ensured by mounting torque (clamping force).

Before assembly you should perform visual inspection (1) contact surfaces for mechanical damages and wipe (2), soaked with alcohol (toluene, gasoline, acetone).

After inspection, fix the current contacts (leads), install a pin to fix the alignment of the structure.

To improve the parameters of heat transfer it is recommended to lubricate (3) a thin layer of silicone thermal conductive paste before the assembly (this is a recommendation and is not a prerequisite for installation).

Install the thyristor (3), the second part of the cooler, the fiberglass insulator and the thrust washer.

To thread the traverse (4) and evenly tighten the nuts. Make sure no misalignment and evenness of the contact surfaces.

When the parts are sufficiently clamped but moveable, we recommend placing the cooler on a flat surface and checking the tolerance for parallelism of the overall adjacent plane of the surfaces (5).

Clamp each nut in turn (about a quarter turn) to the stop (6). The amount of deflection of the traverse determines whether the achieved clamping force corresponds to the required one.

After installation, the fasteners (nuts and washers) must be additionally secured against corrosion.

Tips and recommendations for power thyristors:

The power thyristors should not be operated for long periods of time at their limit load for all parameters. In this case, the safety factor is determined by the required degree of reliability of the device.

Replace a failed power thyristor with a thyristor that matches the parameters of the one being replaced.

Supercooling must be provided when operating in an environment with an elevated ambient temperature.

Periodic cleaning of power thyristors and coolers to remove dust and contaminants is recommended to ensure proper heat dissipation.

Inductive current dividers (often twisted toroidal wire) should be used to equalize currents between power thyristors connected in parallel. The most popular connection methods are closed circuit, common coil circuit, or power thyristor. The efficiency of current dividers in this case is determined by the cross section of the magnetic wire.

Prevention of voltage unbalance when power thyristors are connected in series is achieved by using shunt resistors connected in parallel with each thyristor. Voltage equalization in transient conditions is provided by connecting capacitors in parallel to each thyristor.

It is strictly forbidden to touch power thyristors under high voltage during operation.

Why choose AS ENERGI^TM

Own production facilities, including semiconductor silicon chips production
European brand - 100% quality, favorable price, short production terms
Over 20 years of experience in the semiconductor industry
Clients from more than 50 countries trust us
20000 items in the product line for currents from 10A to 15000A, voltages from 100V to 9000V
We produce analogues of other manufacturers' products
Guaranteed certified quality, warranty period of operation - 2 years

Quality Warranty

Our products are certified and correspond to international standards.
Our company provides a quality guarantee for products of 2 years.
We provide certificates of conformity, reliability reports, data sheets and technical passports at the request of the customer.

Each product is tested for the main parameters, and Test reports of the parameters for each product are provided.

Geography of partnership

AS ENERGI^TM company manufactures and supplies power semiconductors to more than 50 countries around the world.

Logistics and Delivery

We deliver our products all over the world with the services of logistics companies: DHL, TNT, UPS, EMS, Fedex, Aramex.
Products can be delivered by any means of transport: air, sea, rail and road.

AS ENERGI^TM Semiconductors Manufacturing

Our products range includes rectifier diodes, phase control thyristors in disc and stud design, avalanche diodes and thyristors, fast switching, high frequency thyristors, fast recovery, welding and rotor diodes, triacs, bridge rectifiers, power modules (thyristor, diode, thyristor-diode, IGBT), and air and water heatsinks to them.

Power diodes and thyristors are produced for currents from 10A to 15000A, voltage range from 100V to 9000V.
Power diode and thyristor modules are produced from 25A and up to 1250A, voltage range 400V - 4400V.
The range of power semiconductors also includes equivalent, replacement, analogue and alternative semiconductor devices of global manufacturers.

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