alseryabDual Diode Modules SKKD, SEMIPACK
Modules SKKD Semikron are non-controllable rectifiers for AC/DC converters in monolithic design with dual topology of semiconductors (two switches): diode-diode type. Used in DC and AC circuits with loads to 701A and reverse pulse voltages up to 2200V.
Diode Modules AMKD AS ENERGITM is a replacement, equivalent and alternative semiconductor device for modules SKKD Semikron.
The diode modules are housed in a SEMIPACK – industry-standard housing making it easy to integrate the device into existing equipment.
SEMIPACK family has three different internal constructions:
soldered construction (SEMIPACK 1) – the contact is established by solder layers;
bonded construction (SEMIPACK 0, 2, 3) – the connection between top electrode of the chips and DBCs is realized by bond wires;
pressure contact construction (SEMIPACK 3, 4, 5, 6) – the contact is established by pressure, solder free assembly.
The main (power) terminals are on the top of the case and are marked as 1, 2, 3 (common anode-cathode, cathode, anode).
SKKD rectifier diode modules are used in various power equipment - power and control units, power regulators, converters, controllers, welding equipment, and as rectifiers for AC converters.
Our company provides a quality guarantee for thyristor / diode modules of 2 years from the date of purchase. When supplying thyristor / diode modules, if necessary, we provide technical passport and certificate of conformity.
The final price of thyristor / diode modules depends on the class, quantity, delivery terms, manufacturer, country of origin and form of payment.
For questions regarding the acquisition of Power Rectifier Modules, Diodes, Thyristors, send an email request to:
And we will provide you a commercial offer for delivery.
For a large number, we will provide an individual price!!!
We are open to manufacture products at our production facilities
according to your requests and technical task.
Housings of Rectifier Diode Modules SKKD
SEMIPACK 1 |
SEMIPACK 2 |
SEMIPACK 3 bonded |
SEMIPACK 3 pressure contact |
SEMIPACK 5 |
General specifications of Rectifier Diode Modules SKKD
| Series | Type | IFAV (Tcase) |
VRRM | IFSM | I2t | V(TO) | rT | Tvj max | Rth(j-c) (per chip) |
W | Package, Dimensions L×B×H |
Data-sheet | |
| A | V | A | kA2·s | V | mΩ | ºC | ºC/W | g | mm | ||||
| SEMIPACK 1 | |||||||||||||
| SKKD 26 | SKKD 26/12 | 31 (85ºC) 26 (93ºC) |
1200-1600 | 480 | 1.15 | 0.85 | 6.0 | 125 | 1.00 | 95 | SEMIPACK 1 93x20x30 |
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| SKKD 26/14 | |||||||||||||
| SKKD 26/16 | |||||||||||||
| SKKD 46 | SKKD 46/08 | 47 (85ºC) 45 (86ºC) |
800-1800 | 600 | 1.80 | 0.85 | 5.0 | 125 | 0.06 | 95 | SEMIPACK 1 93x20x30 |
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| SKKD 46/12 | |||||||||||||
| SKKD 46/14 | |||||||||||||
| SKKD 46/16 | |||||||||||||
| SKKD 46/18 | |||||||||||||
| SKKD 81 | SKKD 81/08 | 82 (85ºC) 80 (87ºC) |
800-1800 | 1750 | 15 | 0.85 | 1.8 | 125 | 0.40 | 95 | SEMIPACK 1 93x20x30 |
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| SKKD 81/12 | |||||||||||||
| SKKD 81/14 | |||||||||||||
| SKKD 81/16 | |||||||||||||
| SKKD 81/18 | |||||||||||||
| SKKD 81 H4 | SKKD 81/20 H4 | 82 (85ºC) 80 (87ºC) |
2000-2200 | 1750 | 15 | 0.85 | 1.8 | 125 | 0.40 | 95 | SEMIPACK 1 93x20x30 |
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|
| SKKD 81/22 H4 | |||||||||||||
| SKKD 100 | SKKD 100/04 | 100 (85ºC) 67 (100ºC) |
400-1800 | 2000 | 20 | 0.85 | 1.3 | 125 | 0.35 | 95 | SEMIPACK 1 93x20x30 |
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| SKKD 100/06 | |||||||||||||
| SKKD 100/08 | |||||||||||||
| SKKD 100/12 | |||||||||||||
| SKKD 100/14 | |||||||||||||
| SKKD 100/16 | |||||||||||||
| SKKD 100/18 | |||||||||||||
| SKKD 101 | SKKD 101/16 | 134 (85ºC) 101 (100ºC) |
1600 | 2000 | 20 | 0.87 | 2.45 | 130 | 0.19 | 75 | SEMIPACK 1 93x20x30 |
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|
| SEMIPACK 2 | |||||||||||||
| SKKD 152 H1 | SKKD 152/16 H1 | 171 (85ºC) 132 (100ºC) |
1600 | 4500 | 101 | 0.82 | 1.35 | 135 | 0.20 | 165 | SEMIPACK 2 94x34x30 |
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|
| SKKD 162 | SKKD 162/08 | 195 (85ºC) 160 (95ºC) |
800-2200 | 5000 | 125 | 0.85 | 1.20 | 125 | 0.18 | 165 | SEMIPACK 2 94x34x30 |
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| SKKD 162/12 | |||||||||||||
| SKKD 162/14 | |||||||||||||
| SKKD 162/16 | |||||||||||||
| SKKD 162/18 | |||||||||||||
| SKKD 162/20 H4 | |||||||||||||
| SKKD 162/22 H4 | |||||||||||||
| SKKD 212 | SKKD 212/12 | 212 (85ºC) 165 (100ºC) |
1200-1800 | 5500 | 151 | 0.75 | 1.05 | 135 | 0.18 | 165 | SEMIPACK 2 94x34x30 |
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| SKKD 212/14 | |||||||||||||
| SKKD 212/16 | |||||||||||||
| SKKD 212/18 | |||||||||||||
| SKKD 250 | SKKD 250/16 | 255 (85ºC) 199 (100ºC) |
1600-1800 | 6000 | 180 | 0.77 | 1.00 | 135 | 0.13 | 165 | SEMIPACK 2 94x34x30 |
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| SKKD 250/18 | |
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| SEMIPACK 3 | |||||||||||||
| SKKD 260 | SKKD 260/08 | 260 (85ºC) 185 (100ºC) |
800-2200 | 10000 | 500 | 0.90 | 0.37 | 130 | 0.14 | 600 | SEMIPACK 3 115x50x52 |
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| SKKD 260/12 | |||||||||||||
| SKKD 260/14 | |||||||||||||
| SKKD 260/16 | |||||||||||||
| SKKD 260/18 | |||||||||||||
| SKKD 260/20 H4 | |||||||||||||
| SKKD 260/22 H4 | |||||||||||||
| SKKD 353 | SKKD 353/12 | 350 (85ºC) 260 (100ºC) |
1200-1800 | 9500 | 451 | 0.84 | 0.75 | 130 | 0.09 | 600 | SEMIPACK 3 115x50x52 |
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| SKKD 353/14 | |||||||||||||
| SKKD 353/16 | |||||||||||||
| SKKD 353/18 | |||||||||||||
| SKKD 380 | SKKD 380/08 | 380 (100ºC) | 800-2200 | 10000 | 500 | 0.80 | 0.35 | 150 | 0.11 | 600 | SEMIPACK 3 115x50x52 |
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| SKKD 380/12 | |||||||||||||
| SKKD 380/14 | |||||||||||||
| SKKD 380/16 | |||||||||||||
| SKKD 380/18 | |||||||||||||
| SKKD 380/20 H4 | |||||||||||||
| SKKD 380/22 H4 | |||||||||||||
| SEMIPACK 5 | |||||||||||||
| SKKD 700 | SKKD 700/08 | 700 (100ºC) | 800-2200 | 22000 | 2420 | 0.75 | 0.20 | 150 | 0.065 | 1420 | SEMIPACK 5 150x60x52 |
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| SKKD 700/12 | |||||||||||||
| SKKD 700/14 | |||||||||||||
| SKKD 700/16 | |||||||||||||
| SKKD 700/18 | |||||||||||||
| SKKD 700/20 H4 | |||||||||||||
| SKKD 700/22 H4 | |||||||||||||
| SKKD 701 | SKKD 701/12 | 701 (100ºC) 820 (85ºC) |
1200-2200 | 22500 | 2530 | 0.70 | 0.28 | 160 | 0.072 | 1400 | SEMIPACK 5 150x60x52 |
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| SKKD 701/16 | |||||||||||||
| SKKD 701/18 | |||||||||||||
| SKKD 701/22 H4 | |||||||||||||
Part numbering guide for dual diode modules SKKD:
| SK | KD | 380 | – | 22 | H4 |
| SK | – | SEMIKRON component. |
| KD | – | Topology of internal connection: Diode–Diode. |
| 380 | – | Rated current (ITAV), A. |
| 22 | – | Voltage class (VRRM/100). |
| H4 | – | Option, where applicable, e.g H4 stands for Visol = 4800 V. H1 stands for Visol = 3600 V. |
Recommendations for mounting power modules
Heatsink and Surface Specifications, Preparation
In order to ensure good thermal contact and to obtain the thermal contact resistance values specified in the datasheets, the contact surface of the heat sink must be clean and free from dust particles. It is useful to clean the mounting surface of the heat sink with wipes and an alcohol cleaner, e.g. isopropanol, right before the mounting process. The following mechanical specifications have to be met:
– Unevenness of heat sink mounting area must be ≤ 50μm per 100 mm
– Roughness Rz: < 10 μm
– No steps > 10 μm
Heat sink surface specification |
Applying Thermal Paste
Recommended to use stencil printing in order to apply thermal interface material. Recommended to use thermal paste thickness in the range from 50 μm to 100 μm. Applying thermal paste by means of roller is not recommended for mass production as reproducible of an optimized thermal paste thickness cannot be guaranteed.
Mounting torque on heat sink MS
To secure power modules, the use of steel screws in combination with suitable washers and spring lock washers or combination screws is strongly recommended. The specified in datasheet torque value must be observed.
A pre-tightening torque and retightening to the given torque value is recommended. For the screwing process the speed has to be limited and soft torque limitation is recommended to avoid torque peaks, which may occur with pneumatic screwdrivers.
Example of mounting order |
The screws must be tightened in diagonal order with equal torque in several steps until the specified torque value MS has been reached.
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