Air Cooling Heatsink for Disc type thyristor & rectifier diode
Air Cooling Heatsinks for single- and double-sided cooling disc type power SCR thyristors and rectifier diodes during their operation.
Heatsinks are used for semiconductor devices for currents from 100A to 6300A and voltages VDRM/VRRM up to 7000V.
Heatsinks are used for disc (tablet type) semiconductors with сontact surface diameter from Ø19 mm to Ø100 mm.
Features: natural air cooling and forced air cooling; corrosion-resistant aluminum alloy; low thermal resistance; easy installation with a mounting slot; can be either standard models can also be customizing.
For minimum electrical losses and maximum heat dissipation of the devices, the appropriate mounting force Fm specified in the power device specifications must be observed.
Current range of disc type SCR thyristors and rectifier diodes for which air heat sinks (coolers, radiators) are used: 100A, 150A, 160A, 200A, 250A, 300A, 320A, 400A, 500A, 600A, 630A, 800A, 1000A, 1250A, 1500A, 1600A, 2000A, 2500A, 3000A, 3200A, 4000A, 5000A, 6000A, 6300A.
Heat sinks are made of aluminum radiator profiles and do not require additional protective coating when used in different climatic conditions.
Assembly of semiconductor devices (power diodes, thyristors) of tabular design with coolers is done by clamping bolts and traverse.
The contact surfaces of the heatsink and power device must have low roughness and flatness deviations.
Before mounting the contact surfaces of the heatsink, current contact and semiconductor device should be wiped with a cloth soaked in alcohol (toluene, benzene, acetone) and it is recommended to lubricate with a thin layer of silicone-organic heat transfer paste (this is a recommendation and is not a prerequisite for installation).
Specifications and parameters, dimensions, drawings of air-cooled heat sink (radiator) are listed below.
Our company provides a quality guarantee for air cooling heatsink of 2 years from the date of purchase. When supplying heatsinks, if necessary, we provide technical passport.
The final price of air cooling heatsink depends on the quantity, delivery terms, manufacturer, country of origin and form of payment.
Air Cooling Heatsinks for disc type power semiconductors
|Type||Contact surface diameter||Power dissipation with natural cooling
|Thermal resistance Rth(h-a)||Flow resist. ΔPh||Mounting force Fm, max||Cooling surface area||Weight||Outline, dimensions B×L×H||Applies to devices for current|
|natural cooling||forced cooling (airflow Vcfh=6 m/s)|
|Ø22||120||0.710||0.212||20||8 ± 1.5||-||2.0||150×100×122||100A - 500A|
|Ø42||120||0.500||0.125||30||15 ± 1.5||3656.9||3.0||185×150×125||200A - 2000A|
|Ø42||220||0.280||0.080||30||15 ± 1.5||5957.2||5.8||230×150×170||200A - 2000A|
|Ø42||220||0.355||0.100||30||15 ± 1.5||5957.2||5.3||230×150×150||200A - 2000A|
|Ø55||220||0.260||0.075||30||26 ± 2||5957.2||6.0||230×150×176||500A - 6300A|
|Ø55||220||0.355||0.100||30||26 ± 2||5957.2||5.5||230×150×156||500A - 6300A|
|Ø76||400||0.195||0.060||35||50 ± 10||-||12||265×250×225||1000A - 6300A|
|Ø76||500||0.166||0.047||40||50 ± 10||-||13||280×250×195||1000A - 6300A|
|Ø100||650||0.107||0.030||50||80 ± 10||-||28||385×300×305||1600A - 6300A|
Application of air cooling heatsinks for disc type semiconductors
|Type||Contact surface diameter||Applied device housing||Applies to devices for current||Application
diode, thyristor type
|сontact surface||outside diameter|
|O123||Ø22||Ø19-Ø22||Ø42||100A - 500A||PD21, PD22, PD23, PT21, PT21-1, PT23||DL123, T123, T223, T323, TFI323|
|O143||Ø42||Ø25-Ø38||Ø42-Ø60||200A - 2000A||PD32, PD42, PD43, PD44, PT31, PT32, PT41, PT42, PT43, D.B1, D.B2, D.C2, T.B2, T.B3, T.C1, T.C2, T.C3||D133, D233, D143, D243, T133, T233, T333, T433, T933, TF133, TF233, TF333, TF433, TF833, TF933, TFI133, TFI233, TFI333, TFI433, TFI533, TFI833, TFI933, T143, T243, T343, T443, T643, T743, TF143, TF243, TF343, TF943, TFI143, TFI243, TFI343, TFI443, TFI543, TFI643|
|O243||Ø42||Ø25-Ø38||Ø42-Ø60||200A - 2000A||PD32, PD42, PD43, PD44, PT31, PT32, PT41, PT42, PT43, D.B1, D.B2, D.C2, T.B2, T.B3, T.C1, T.C2, T.C3||D133, D233, D143, D243, T133, T233, T333, T433, T933, TF133, TF233, TF333, TF433, TF833, TF933, TFI133, TFI233, TFI333, TFI433, TFI533, TFI833, TFI933, T143, T243, T343, T443, T643, T743, TF143, TF243, TF343, TF943, TFI143, TFI243, TFI343, TFI443, TFI543, TFI643|
|O343||Ø42||Ø25-Ø38||Ø42-Ø60||200A - 2000A||PD32, PD42, PD43, PD44, PT31, PT32, PT41, PT42, PT43, D.B1, D.B2, D.C2, T.B2, T.B3, T.C1, T.C2, T.C3||D133, D233, D143, D243, T133, T233, T333, T433, T933, TF133, TF233, TF333, TF433, TF833, TF933, TFI133, TFI233, TFI333, TFI433, TFI533, TFI833, TFI933, T143, T243, T343, T443, T643, T743, TF143, TF243, TF343, TF943, TFI143, TFI243, TFI343, TFI443, TFI543, TFI643|
|O153||Ø55||Ø42-Ø51||Ø60-Ø75||500A - 6300A||PD50, PD53, PD54, PT51, PT53, PT53-1, PT54, PTO54, D.D2, T.D1, T.D2, T.D5||D153, D253, DL153, T153, T253, T353, T453, T553, T653, T753, T853, T953, TF153, TF253, TF453, TF553, TF953, TFI153, TFI253, TFI353, TFI453, TL253|
|O253||Ø55||Ø42-Ø51||Ø60-Ø75||500A - 6300A||PD50, PD53, PD54, PT51, PT53, PT53-1, PT54, PTO54, D.D2, T.D1, T.D2, T.D5||D153, D253, DL153, T153, T253, T353, T453, T553, T653, T753, T853, T953, TF153, TF253, TF453, TF553, TF953, TFI153, TFI253, TFI353, TFI453, TL253|
|O173||Ø76||Ø60-Ø75||Ø85-Ø112||1000A - 6300A||PD63, PD73, PT63, PT73, D.F1, D.F3, T.F1, T.F2, T.F5||D163, D173, T163, T263, T663, TFI163, TFI263, T173, T273, T373, T673, TF173, TF273, TFI173, TFI273, TFI373, TFI473, TFI573, TFI673, TFI773, TFI873|
|O273||Ø76||Ø60-Ø75||Ø85-Ø112||1000A - 6300A||PD63, PD73, PT63, PT73, D.F1, D.F3, T.F1, T.F2, T.F5||D163, D173, T163, T263, T663, TFI163, TFI263, T173, T273, T373, T673, TF173, TF273, TFI173, TFI273, TFI373, TFI473, TFI573, TFI673, TFI773, TFI873|
|O193||Ø100||Ø80-Ø100||Ø120-Ø150||1600A - 6300A||PD83, PD93, PT83, PT93, PT94, PTT94, PTO95, D.G1, T.H1, T.G5||D183, D193, T183, T283, T383, T583, T683, TFI183, T193, T293, T393, T693, TFI193|
Part Numbering Guide for air cooling heatsinks:
|O||–||Product group: Heatsinks for semiconductors.|
|1||–||Serial number of heatsink design modification.|
|5||–||Series coding by contact surface diameter for disc type heatsinks.|
|3||–||Serial number of the heatsink design modification for devices: 1 - disc design with double-sided cooling.|
|150||–||Length of the heatsink, mm.|
High Power Semiconductors AS ENERGITM
Our company is engaged in the manufacturer and sale of wide range of power semiconductors (power thyristors, modules, rectifier diodes, avalanche, rotor and welding diodes, triacs etc.) currents up to 15000A and voltages to 9000V, and air and water heatsinks to them.
You can buy semiconductor devices in any volumes, and when ordering large lots, the price will be lower. We have earned the trust of customers and supply products all over the world.
For questions regarding the acquisition of Power Thyristors, Diodes, Modules send an email request to:
And we will provide you a commercial offer for delivery.
For a large number, we will provide an individual price!!!
We are open to manufacture products at our production facilities
according to your requests and technical task.
Recommendations for assembling a disc thyristor with an air heatsink:
The reliability of heat transfer and electrical contact between the mating surfaces of the thyristor and the cooler over the entire temperature range is ensured by mounting torque (clamping force).
Before assembly you should perform visual inspection (1) contact surfaces for mechanical damages and wipe (2), soaked with alcohol (toluene, gasoline, acetone).
After inspection, fix the current contacts (leads), install a pin to fix the alignment of the structure.
To improve the parameters of heat transfer it is recommended to lubricate (3) a thin layer of silicone thermal conductive paste before the assembly (this is a recommendation and is not a prerequisite for installation).
Install the thyristor (3), the second part of the cooler, the fiberglass insulator and the thrust washer.
To thread the traverse (4) and evenly tighten the nuts. Make sure no misalignment and evenness of the contact surfaces.
When the parts are sufficiently clamped but moveable, we recommend placing the cooler on a flat surface and checking the tolerance for parallelism of the overall adjacent plane of the surfaces (5).
Clamp each nut in turn (about a quarter turn) to the stop (6). The amount of deflection of the traverse determines whether the achieved clamping force corresponds to the required one.
After installation, the fasteners (nuts and washers) must be additionally secured against corrosion.
Tips and recommendations for power thyristors:
The power thyristors should not be operated for long periods of time at their limit load for all parameters. In this case, the safety factor is determined by the required degree of reliability of the device.
Replace a failed power thyristor with a thyristor that matches the parameters of the one being replaced.
Supercooling must be provided when operating in an environment with an elevated ambient temperature.
Periodic cleaning of power thyristors and coolers to remove dust and contaminants is recommended to ensure proper heat dissipation.
Inductive current dividers (often twisted toroidal wire) should be used to equalize currents between power thyristors connected in parallel. The most popular connection methods are closed circuit, common coil circuit, or power thyristor. The efficiency of current dividers in this case is determined by the cross section of the magnetic wire.
Prevention of voltage unbalance when power thyristors are connected in series is achieved by using shunt resistors connected in parallel with each thyristor. Voltage equalization in transient conditions is provided by connecting capacitors in parallel to each thyristor.
It is strictly forbidden to touch power thyristors under high voltage during operation.
Why choose AS ENERGITM
- Own production facilities, including semiconductor silicon chips production
- European brand - 100% quality, favorable price, short production terms
- Over 20 years of experience in the semiconductor industry
- Clients from more than 50 countries trust us
- 20000 items in the product line for currents from 10A to 15000A, voltages from 100V to 9000V
- We produce analogues of other manufacturers' products
- Guaranteed certified quality, warranty period of operation - 2 years
Our products are certified and correspond to international standards.
Our company provides a quality guarantee for products of 2 years.
We provide certificates of conformity, reliability reports, data sheets and technical passports at the request of the customer.
Each product is tested for the main parameters, and Test reports of the parameters for each product are provided.
Geography of partnership
AS ENERGITM company manufactures and supplies power semiconductors to more than 50 countries around the world.
Logistics and Delivery
We deliver our products all over the world with the services of logistics companies: DHL, TNT, UPS, EMS, Fedex, Aramex.
Products can be delivered by any means of transport: air, sea, rail and road.
AS ENERGITM Semiconductors Manufacturing
Our products range includes rectifier diodes, phase control thyristors in disc and stud design, avalanche diodes and thyristors, fast switching, high frequency thyristors, fast recovery, welding and rotor diodes, triacs, bridge rectifiers, power modules (thyristor, diode, thyristor-diode, IGBT), and air and water heatsinks to them.
Power diodes and thyristors are produced for currents from 10A to 15000A, voltage range from 100V to 9000V.
Power diode and thyristor modules are produced from 25A and up to 1250A, voltage range 400V - 4400V.
The range of power semiconductors also includes equivalent, replacement, analogue and alternative semiconductor devices of global manufacturers.