Air Cooling Heatsink O143 for disc SCR thyristor & rectifier diode

Heatsink contact surface diameter Ø42 mm
Applied device housing сontact surface Ø25 - Ø38 mm
outside diameter Ø42 - Ø60 mm
Applies to devices for current 200A - 2000A
Power dissipation 120 W
Heatsink O143 on request
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Dimensions B×L×H 185×150×125 mm
Weight 3.0 kg

Air Cooling Heatsinks O143-150 AS ENERGITM are used for single- and double-sided cooling of power semiconductor devices in disc design, with housing type PD32, PD42, PD43, PD44, PT31, PT32, PT41, PT42, PT43, D.B1, D.B2, D.C2, T.B2, T.B3, T.C1, T.C2, T.C3.

The power dissipation of the cooler with natural cooling is 120 W. Heatsink contact surface diameter is Ø42 mm. Applied device housing: сontact surface Ø25-Ø38 mm, outside diameter Ø42-Ø60 mm.

Heatsink is used for cooling of power SCR thyristors and rectifier diodes for currents 200A - 2000A.

Airflow cooling can be natural or forced, depending on the amount of heat generated and the operating conditions of the semiconductors.

Features: corrosion-resistant aluminum alloy; low thermal resistance; easy installation with a mounting slot; can be either standard models can also be customizing.

Heat sinks are made of aluminum radiator profiles and do not require additional protective coating when used in different climatic conditions.

Assembly of semiconductor devices (power diodes, thyristors) of tablet (disk) design with coolers is done by clamping bolts and traverse. The contact surfaces of the heatsink and power device must have low roughness and flatness deviations.

For minimum electrical losses and maximum heat dissipation of the devices, the appropriate mounting force Fm specified in the power device specifications must be observed.

Before mounting the contact surfaces of the heatsink, current contact and semiconductor device should be wiped with a cloth soaked in alcohol (toluene, benzene, acetone) and it is recommended to lubricate with a thin layer of silicone-organic heat transfer paste (this is a recommendation and is not a prerequisite for installation).

Current range of disc type SCR thyristors and rectifier diodes for which air heat sinks (coolers, radiators) are used: 200A, 250A, 300A, 320A, 400A, 500A, 600A, 630A, 700A, 800A, 1000A, 1200A, 1250A, 1300A, 1400A, 1500A, 1600A, 1700A, 1800A, 1900A, 2000A.

Specifications and parameters, dimensions, outlines and drawings of air-cooled heat sink (radiator) are listed below.

Our company provides a quality guarantee for air cooling heatsink of 2 years from the date of purchase. When supplying heatsinks, if necessary, we provide technical passport.

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The final price of air cooling heatsink depends on the quantity, delivery terms, manufacturer, country of origin and form of payment.

Air Cooling Heatsink O143 specifications:

Heatsink specifications O143 (O143-150)
Heatsink contact surface diameter Ø42 mm
Applied device housing (сontact surface) Ø25 - Ø38 mm
Applied device housing (outside diameter) Ø42 - Ø60 mm
Power dissipation with natural cooling (PF) 120 W
Thermal resistance Rth(h-a) (natural cooling) 0.500 °C/W
Thermal resistance Rth(h-a) (forced cooling, airflow Vcfh=6 m/s) 0.125 °C/W
Flow resistance ΔPh 30 Pa
Mounting force Fm, max 15 ± 1.5 kN
Cooling surface area 3656.9 cm2
Weight 3.0 kg
Outline, dimensions B×L×H 185×150×125 mm
Applies to devices for current 200A - 2000A
Application package type PD32, PD42, PD43, PD44, PT31, PT32, PT41, PT42, PT43, D.B1, D.B2, D.C2, T.B2, T.B3, T.C1, T.C2, T.C3
Application diode, thyristor type D133, D233, D143, D243, T133, T233, T333, T433, T933, TF133, TF233, TF333, TF433, TF833, TF933, TFI133, TFI233, TFI333, TFI433, TFI533, TFI833, TFI933, T143, T243, T343, T443, T643, T743, TF143, TF243, TF343, TF943, TFI143, TFI243, TFI343, TFI443, TFI543, TFI643

Overall and mounting dimensions of the heat sink O143:

Heatsink dimensions

Part Numbering Guide for Air Cooling Heatsinks O143:

O 1 4 3 150
O Product group: Heatsinks for semiconductors.
1 Serial number of heatsink design modification.
4 Series coding by contact surface diameter for disc type heatsinks.
3 Serial number of the heatsink design modification for devices: 1 - disc design with double-sided cooling.
150 Length of the heatsink, mm.

Graphs of thermal parameters of the cooler O143:

Thermal parameters

a) — transient thermal resistance contact surface of the cooler - cooling environment (1-0 m/s (120W); 2-3 m/s; 3-6 m/s; 4-12 m/s)
b) — thermal resistances contact surface of the cooler - cooling environment,
depending on the power dissipation during natural cooling
c) — cooling air temperature difference, related to power dissipation, depending on the cooling air velocity
d) — pressure difference of cooling environment flow, depending on the cooling air velocity


Photo of Air Cooling Heatsinks O143 for disc type semiconductors:



High Power Semiconductors AS ENERGITM

Our company is engaged in the manufacturer and sale of wide range of power semiconductors (power thyristors, modules, rectifier diodes, avalanche, rotor and welding diodes, triacs etc.) currents up to 15000A and voltages to 9000V, and air and water heatsinks to them.
You can buy semiconductor devices in any volumes, and when ordering large lots, the price will be lower. We have earned the trust of customers and supply products all over the world.

For questions regarding the acquisition of Power Thyristors, Diodes, Modules send an email request to:

[email protected]

And we will provide you a commercial offer for delivery.
For a large number, we will provide an individual price!!!

We are open to manufacture products at our production facilities
according to your requests and technical task.


Photo Gallery

The photo gallery shows many different semiconductor devices, semiconductor chips and SCRs produced by AS ENERGITM, examples of test reports.


Recommendations for assembling a disc thyristor with an air heatsink:

Assembling disc thyristor with a heatsink

The reliability of heat transfer and electrical contact between the mating surfaces of the thyristor and the cooler over the entire temperature range is ensured by mounting torque (clamping force).

Before assembly you should perform visual inspection (1) contact surfaces for mechanical damages and wipe (2), soaked with alcohol (toluene, gasoline, acetone).

After inspection, fix the current contacts (leads), install a pin to fix the alignment of the structure.

To improve the parameters of heat transfer it is recommended to lubricate (3) a thin layer of silicone thermal conductive paste before the assembly (this is a recommendation and is not a prerequisite for installation).

Install the thyristor (3), the second part of the cooler, the fiberglass insulator and the thrust washer.

To thread the traverse (4) and evenly tighten the nuts. Make sure no misalignment and evenness of the contact surfaces.

When the parts are sufficiently clamped but moveable, we recommend placing the cooler on a flat surface and checking the tolerance for parallelism of the overall adjacent plane of the surfaces (5).

Clamp each nut in turn (about a quarter turn) to the stop (6). The amount of deflection of the traverse determines whether the achieved clamping force corresponds to the required one.

After installation, the fasteners (nuts and washers) must be additionally secured against corrosion.



Tips and recommendations for power thyristors:

The power thyristors should not be operated for long periods of time at their limit load for all parameters. In this case, the safety factor is determined by the required degree of reliability of the device.

Replace a failed power thyristor with a thyristor that matches the parameters of the one being replaced.

Supercooling must be provided when operating in an environment with an elevated ambient temperature.

Periodic cleaning of power thyristors and coolers to remove dust and contaminants is recommended to ensure proper heat dissipation.

Inductive current dividers (often twisted toroidal wire) should be used to equalize currents between power thyristors connected in parallel. The most popular connection methods are closed circuit, common coil circuit, or power thyristor. The efficiency of current dividers in this case is determined by the cross section of the magnetic wire.

Prevention of voltage unbalance when power thyristors are connected in series is achieved by using shunt resistors connected in parallel with each thyristor. Voltage equalization in transient conditions is provided by connecting capacitors in parallel to each thyristor.

Device under voltage

It is strictly forbidden to touch power thyristors under high voltage during operation.


icon Why choose AS ENERGITM

  • Own production facilities, including semiconductor silicon chips production
  • European brand - 100% quality, favorable price, short production terms
  • Over 20 years of experience in the semiconductor industry
  • Clients from more than 50 countries trust us
  • 20000 items in the product line for currents from 10A to 15000A, voltages from 100V to 9000V
  • We produce analogues of other manufacturers' products
  • Guaranteed certified quality, warranty period of operation - 2 years

 

Quality Warranty

Our products are certified and correspond to international standards.
Our company provides a quality guarantee for products of 2 years.
We provide certificates of conformity, reliability reports, data sheets and technical passports at the request of the customer.

Certificates

Each product is tested for the main parameters, and Test reports of the parameters for each product are provided.

Test Report

Geography of partnership

AS ENERGITM company manufactures and supplies power semiconductors to more than 50 countries around the world.

Geography

Logistics and Delivery

We deliver our products all over the world with the services of logistics companies: DHL, TNT, UPS, EMS, Fedex, Aramex.
Products can be delivered by any means of transport: air, sea, rail and road.

Logistics

AS ENERGITM Semiconductors Manufacturing

Our products range includes rectifier diodes, phase control thyristors in disc and stud design, avalanche diodes and thyristors, fast switching, high frequency thyristors, fast recovery, welding and rotor diodes, triacs, bridge rectifiers, power modules (thyristor, diode, thyristor-diode, IGBT), and air and water heatsinks to them.

Power diodes and thyristors are produced for currents from 10A to 15000A, voltage range from 100V to 9000V.
Power diode and thyristor modules are produced from 25A and up to 1250A, voltage range 400V - 4400V.
The range of power semiconductors also includes equivalent, replacement, analogue and alternative semiconductor devices of global manufacturers.


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